StratEdge High-performance Semiconductor Packages to be on Display at IMS2019, June 4-6, in Booth 361

3 Jun by Vitaliy Dadalyan

StratEdge High-performance Semiconductor Packages to be on Display at IMS2019, June 4-6, in Booth 361

Removes the heat from high-performance packages

SAN DIEGO–(BUSINESS WIRE)–StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 361 at the International Microwave Symposium (IMS), being held in Boston, MA, from June 4-6. StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS.

“StratEdge packages accommodate the extreme demands of compound semiconductor devices,” said Tim Going, president of StratEdge. “We manufacture our packages to exacting specifications, using hardened or post-fired ceramics that don’t shrink, substrates that dissipate heat, and electrical transition designs for exceptionally low electrical losses. To further ensure optimized performance, StratEdge Assembly Services can package your devices in our new cleanroom, which is equipped with the latest precision wire bonding and die attach systems.”

To arrange a meeting at IMS or for more information, contact StratEdge at [email protected], shop at the StratEdge store on Amazon.com, and/or visit our website at www.stratedge.com.

Photo available at: https://www.stratedge.com/semiconductor-packaging.png

About StratEdge

StratEdge designs and manufactures high-performance semiconductor packages and provides chip assembly services. We specialize in packages for high-frequency, very high power, extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. We have a complete line of post-fired, molded ceramic, and ceramic QFN semiconductor packages that operate from DC to 63+ GHz. Our patented electrical transition designs give StratEdge packages exceptionally low electrical losses, even at 63+ GHz. Markets served include telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS. StratEdge is an ISO 9001:2015 facility.

Contacts

Casey Krawiec
StratEdge Corporation
Email: [email protected]
Phone: (858) 569-5000
Fax: (858) 228-9728

Andrea Roberts
AR Marketing, Inc. (agency)
+1.858.204.9584
E-Mail: [email protected]

This article published with permission from Business Wire